Assembly Packaging Engineer (Semiconductors)

Location : Bedford, Bedfordshire, England
Job Ref : EJ639
Consultant : Edward Jeffs
Sector : Engineering, Manufacturing
Salary : £45k - 55k per year


EJ639 – Assembly Packaging Engineer (Semiconductors)

Location:  Bedford

Salary:  £45,000 – £55,000    


Our client is currently recruiting for an assembly packaging engineer to support their continued growth.

The Assembly Packaging Engineer will provide project management, package design/development and sustaining support for semiconductor diode, power and surge protection assembly.

All applicants will be considered however, our client encourages applications from candidates with a military background.

Duties and Responsibilities:

  • The Semiconductor Assembly Packaging engineer will be responsible for understanding the basic fundamentals and building blocks of the semiconductor packaging manufacturing process.
  • Provide Semiconductor Assembly expertise
  • Experienced in package design and familiar with Auto CAD.
  • Understanding of Jedec specs and background of Rel Test specs, CSAM, XRay, SEM, etc.
  • Understand assembly package design rules.
  • Optimise package lead frame designs
  • Define and qualify new assembly package flows, driving yield improvement.
  • Resolve technical problems with subcontract assembly sites.
  • Assures the proper, complete engineering documentation package to support successful new product launch or product/process implementation per ISO TS16949 standard or better.
  • Advise design groups on robust cost effective assembly techniques /processes.
  • Assembly technology interface between product, process and test engineering, purchasing and quality.
  • Solves chronic problems (quality, performance and cost) related to assembly processes using new materials, technologies, design, FMEA SPC, DOE or other techniques.
  • Keeps informed on trends and developments in assembly of diode, power and surge protection devices.

Skills and Qualifications:

Normally, graduation from an accredited three-year college or university with a degree in Engineering, Science or Mathematics required, or equivalent education, training and experience.
At least 5 years progressive engineering experience working in semiconductor assembly packaging.
Knowledge of Diode and surge protection technology with emphasis on semi-conductor protection components.
Time management and organizational skills. Capable of managing work and deliverables from others with little supervision. Flexible and able to work in a demanding environment with regular international travel.

Location:  Bedford

Salary:  £45,000 – £55,000       

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